Microsystems Packaging Roadmap for Next Generation Wireless Receivers

摘要

Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low power and high quality integrated transceiver solutions. The integration of RF front end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach (SOP) can address the problems in an optimum way. A challenging task is to design integrated passives. These passives are then fabricated using MCM-D technology. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module is implemented using benzocyclobutene (BCB) as interlayer material and liquid crystal polymer (LCP) as substrate.