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首页> 外文期刊>Wood and Fiber Science >Material damage due to electron beam during testing in the environmental scanning electron microscope (ESEM).
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Material damage due to electron beam during testing in the environmental scanning electron microscope (ESEM).

机译:在环境扫描电子显微镜(ESEM)中进行测试期间,由于电子束造成的材料损坏。

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摘要

This study describes the development of cell-wall damage, i.e., the creation of cracks across or in the vicinity of pits during the testing of twenty microtomed spruce (Picea abies) samples in the Environmental Scanning Electron Microscope (ESEM). Samples were investigated both in an unloaded condition and under a constant tensile load and at different moisture levels. Regions of the moisture-cycled samples that had been exposed to an electron beam during image acquisition showed damage running through pits and their surroundings. Specimens loaded in the green condition and dried in the chamber for 2 h without beam exposure except during imaging showed no noticeable cell-wall damage. The results indicate that the electron beam may be a major source of damage initiation. Therefore, it is essential to note the circumstances of the test when explaining the observations made in ESEM studies.
机译:这项研究描述了细胞壁损伤的发展,即在环境扫描电子显微镜(ESEM)中测试20个切片云杉(Picea abies)样品的过程中,在小坑周围或附近产生了裂纹。在空载条件下,恒定的拉伸载荷下以及不同的水分含量下对样品进行了研究。在图像采集过程中已暴露于电子束的水分循环样品区域显示出贯穿凹坑及其周围的损坏。标本在绿色条件下加载并在室中干燥2小时,没有光束暴露,除非在成像过程中显示没有明显的细胞壁损坏。结果表明,电子束可能是引发损伤的主要来源。因此,在解释ESEM研究中的观察结果时,必须注意测试的环境。

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