Top-class SMT forum to be hold In shanghai in 2007 for the first time

摘要

From March 21 -23, 2007, the China SMT Forum (International Conference and Exhibition on Surface Mount Technologies and Microelectronic Packaging Technologies/ MPT) will be held for the first time at the International Convention Center amidst Shanghai's economic and financial centre Pudong. The event is organised by Business Media China AG (BMC) in cooperation with the Shanghai Science & Technology Development and Exchange Center. The new forum has been designed as a specialised platform focussing explicitly on SMT and as a trade fair with accompanying conference. It is supported by the Chinese government as well as by Chinese professional associations. During the past year, China produced electronic devices for more than USD 200 billion - with an upward trend.