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Structure and mechanical properties of reactive sputtered WCN films

机译:反应溅射WCN膜的结构和力学性能

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摘要

The WCN films with different C contents were deposited under different substrate bias by a sputtering system. The composition, structure and mechanical properties were characterised by X-ray photoelectron spectroscopy, X-ray diffraction, high resolution transmission electron microscopy, scanning electron microscopy, atomic force microscopy and nanoindentation. Results showed that the WCN films consisted of WCN, W2N, amorphous C and CNx phases. With the incorporation of C content, the growth pattern changed from continuous columnar to discontinuous columnar due to grain refinement. By applying substrate bias to the films, the growth pattern changed from discontinuous columnar to fine grained structure because the bias could enhance the mobility of impinging ions or atoms leading to film densification. As increasing the C content, the hardness first increased and then decreased due to the effect of solid solution strengthening and grain refinement. However, the substrate bias had little influence on the hardness because of the co-action of the dense structure and residual stress induced by bias.
机译:通过溅射系统在不同的衬底偏压下沉积具有不同C含量的WCN膜。通过X射线光电子能谱,X射线衍射,高分辨率透射电子显微镜,扫描电子显微镜,原子力显微镜和纳米压痕来表征组成,结构和力学性能。结果表明,WCN薄膜由WCN,W2N,非晶C和CNx相组成。随着C含量的加入,由于晶粒细化,生长模式从连续柱状变为不连续柱状。通过向薄膜施加衬底偏压,生长模式从不连续的柱状结构变为细颗粒结构,因为该偏压可增强撞击离子或原子的迁移率,从而导致薄膜致密化。随着C含量的增加,由于固溶强化和晶粒细化的作用,硬度先增加然后降低。然而,由于致密结构的共同作用和偏压引起的残余应力,基底偏压对硬度几乎没有影响。

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