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Investigating the tarnish and corrosion mechanisms of Chinese gold coins

机译:研究中国金币的锈蚀和腐蚀机理

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摘要

In order to investigate the gold coin's tarnish mechanism, the tarnish and corrosion mechanism on Chinese gold coins was investigated by optical microscopy (OM), scanning electron microscope energy dispersive spectrometry (SEM-EDS), electron microprobe analysis (EMPA), XPS and X-ray diffraction (XRD). The results indicated that the tarnish on the gold coin was caused by silver on its surface. The main component of the tarnish stain on the gold coin was silver sulfide and silver sulfate. The stain and the contamination originate from the polishing procedure, which accelerated the tarnish process. Two measures can be taken to prevent the gold coin's tarnish. First, the mintage of gold and silver coins should be separated and, second, a chemical cleaning procedure should be introduced.
机译:为了研究金币的锈蚀机理,通过光学显微镜(OM),扫描电子显微镜能量色散谱(SEM-EDS),电子显微探针分析(EMPA),XPS和X对中国金币的锈蚀和腐蚀机理进行了研究。射线衍射(XRD)。结果表明,金币上的锈蚀是由其表面上的银引起的。金币上失去光泽的污渍的主要成分是硫化银和硫酸银。污渍和污染源自抛光过程,抛光过程加快了锈蚀过程。可以采取两种措施来防止金币变色。首先,应将金币和银币的造币厂分开,其次,应采用化学清洗程序。

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