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Wetting kinetics of the AgCuTi filler metal on pure molybdenum substrate

机译:纯钼基体上AgCuTi钎料的润湿动力学

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Spreading of the AgCuTi filler metal over a pure molybdenum substrate under a high-purity argon atmosphere was studied at elevated temperatures, within the range of 1283 similar to 1373K. Real-time in situ observations and quantitative measurements assisted by hot-stage microscopy were used to analyze the kinetics of the triple-line movement. The state of the interface between the substrate and the resolidified alloy and in the neighborhood of the triple line was considered. The empirical data indicate that wetting of AgCuTi alloy on the pure molybdenum substrate features a similar trend of the triple-line kinetics. The triple-line equivalent radius of the front during spreading increases initially, with a large spreading rate, and subsequently changes gradually the rate approaching to an asymptotic value. Kinetics of the triple-line movement throughout the spreading process shows that the wetting follows the power law, R(n similar to)t, n similar to 8. During spreading, Ag-based solid solution, AgCu eutectic phase, and CuTi binary phase were formed along the interface within the joint zone, hence the spreading evolves under weak reactive conditions. Copyright (c) 2015 John Wiley & Sons, Ltd.
机译:研究了在较高的氩气气氛下,在类似于1373K的1283范围内,AgCuTi填充金属在纯钼衬底上的扩散。实时原位观察和热台显微镜辅助的定量测量被用来分析三线运动的动力学。考虑了基材与再固化合金之间以及三线附近的界面状态。经验数据表明,AgCuTi合金在纯钼基体上的润湿具有类似的三线动力学趋势。扩展过程中,前部的三线等效半径最初以较大的扩展速率增加,然后逐渐变化,逐渐接近渐近值。在整个扩散过程中,三线运动的动力学表明,润湿遵循幂律,R(n类似于)t,n类似于8。在扩散过程中,Ag基固溶体,AgCu共晶相和CuTi二元相沿关节区域内的界面形成,因此扩散在弱反应条件下发生。版权所有(c)2015 John Wiley&Sons,Ltd.

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