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Interface fracture properties of thin films studied by using the micro-cantilever deflection technique

机译:微悬臂梁偏转技术研究薄膜的界面断裂特性

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摘要

The mechanical behavior of interfaces between silicon oxide and metallic thin films is investigated using an alternative approach which is based on the miniaturized cantilever deflection technique (Weihs et al., 1988 [1]). The critical energy release rates for three different silicon oxide/metal systems are determined and the results are discussed in this paper. The technique suggested may be applicable with high spatial resolution for a wide variety of structured thin film systems.
机译:氧化硅和金属薄膜之间的界面的机械行为是使用另一种方法研究的,该方法基于小型化的悬臂偏转技术(Weihs等,1988 [1])。确定了三种不同的氧化硅/金属系统的临界能量释放速率,并对结果进行了讨论。建议的技术可能适用于具有高空间分辨率的各种结构化薄膜系统。

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