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首页> 外文期刊>Surface & Coatings Technology >A new method for electroless Ni-P plating on AZ31 magnesium alloy
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A new method for electroless Ni-P plating on AZ31 magnesium alloy

机译:AZ31镁合金化学镀Ni-P的新方法

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摘要

Coating Ni-P films on AZ31 magnesium alloys via electroless plating and organic coatings (organsilicon heat-resisting varnish), was studied. An organic coating was proposed as the interlayer between Ni-P coating and AZ31 magnesium alloy substrate, to replace the traditional chromium oxide plus HF pretreatment. The Ni-P deposited on the interlayer was also characterized by its structure, morphology and corrosion-resistance. The interlayer on the substrate not only reduces the corrosion of magnesium during Ni-P plating process, but also reduces the potential difference between the matrix and the second phase. The result of the cross-cut test indicates the adhesion between the substrate and the interlayer is good enough. A Ni-P film with fine and dense structure was obtained on the AZ31 magnesium alloy. The electrochemical measurements show that the sample with Ni-P film exhibits lower corrosion current density and more positive corrosion potential than the substrate. Furthermore, the Ni-P coating on the AZ31 magnesium alloy exhibits high corrosion resistance in the rapid corrosion test illustrated in this paper. The method proposed in this work is environmentally friendly: no fluoride or hexacalent chromium compounds are used. In addition, it provides a new concept for plating the metals, which are considered difficult to plate due to high reactivity. (C) 2007 Elsevier B.V. All rights reserved.
机译:研究了通过化学镀和有机涂层(有机硅耐热清漆)在AZ31镁合金上涂覆Ni-P膜的方法。提出了一种有机涂层作为Ni-P涂层与AZ31镁合金基体之间的中间层,以代替传统的氧化铬和HF预处理。沉积在中间层上的Ni-P的特征还在于其结构,形态和耐蚀性。基板上的中间层不仅减少了Ni-P电镀过程中镁的腐蚀,而且减小了基体与第二相之间的电势差。横切测试的结果表明基材和中间层之间的粘合性足够好。在AZ31镁合金上获得了具有细密结构的Ni-P膜。电化学测量表明,具有Ni-P膜的样品比基底具有更低的腐蚀电流密度和更大的正腐蚀电位。此外,在本文说明的快速腐蚀试验中,AZ31镁合金上的Ni-P涂层具有很高的耐腐蚀性。这项工作中提出的方法是环保的:不使用氟化物或六价铬化合物。此外,它为电镀金属提供了新的概念,由于高反应性,金属被认为很难电镀。 (C)2007 Elsevier B.V.保留所有权利。

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