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Ion beam modification of ceramic component prior to formation of AlN-Cu joints by direct bonding process

机译:通过直接键合工艺在形成AlN-Cu接头之前对陶瓷组件进行离子束改性

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摘要

Ion implantation was utilized as a pre-treatment method for direct bonding of ceramics with copper. Aluminum nitride samples were implanted with metallic ions (Ti, Cr, Fe, Cu) and/or with oxygen. The choice of implanted species was based upon thermodynamic considerations. Direct bonding was performed by a conventional method of furnace annealing in nitrogen atmosphere. Shear strength measurements of the joints were used as a method of joint quality verification. The samples were additionally characterized by RBS measurements and the shear fracture surface was analyzed by optical microscopy. It has been concluded that the joints formed on ion implantation pre-treated aluminum nitride exhibit superior quality with respect to conventionally treated (oxidized) material. It has also been found that the optimum properties are exhibited by material in which thin titanium nitride surface layer is formed by low-fluence Ti implantation and that the presence of oxygen has a detrimental effect upon the joint quality, although oxygen implantation is potentially a promising approach. (c) 2007 Elsevier B.V. All rights reserved.
机译:离子注入被用作陶瓷与铜直接粘合的预处理方法。将金属离子(Ti,Cr,Fe,Cu)和/或氧气注入氮化铝样品。植入物种的选择基于热力学考虑。通过在氮气氛中的常规炉退火方法进行直接结合。接头的抗剪强度测量值用作接头质量验证的方法。样品还通过RBS测量进行表征,并通过光学显微镜分析剪切断裂表面。已经得出的结论是,在离子注入预处理的氮化铝上形成的接头相对于常规处理(氧化)的材料表现出优异的质量。还已经发现,通过低通量钛注入形成薄的氮化钛表面层的材料具有最佳性能,并且氧的存在对接头质量有不利影响,尽管氧注入可能有希望方法。 (c)2007 Elsevier B.V.保留所有权利。

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