...
首页> 外文期刊>Surface & Coatings Technology >Microstructure and thermal stability of nickel layers electrodeposited from an additive-free sulphamate-based electrolyte
【24h】

Microstructure and thermal stability of nickel layers electrodeposited from an additive-free sulphamate-based electrolyte

机译:无添加剂氨基磺酸盐基电解质电沉积镍层的微观结构和热稳定性

获取原文
获取原文并翻译 | 示例
           

摘要

The influences of the current density and the temperature on the microstructure and hardness of Ni layers electrodeposited from an additive-free sulphamate bath were investigated. The microstructure and thermal stability of the electrodeposits was investigated with a combination of transmission and scanning electron microscopy and X-ray diffraction; the Vickers microhardness was measured in cross-sections. The present article is meant as a reference for forthcoming articles on the investigation of various strengthening mechanisms on the microstructure, hardness and thermal stability of Ni (alloy) electrodeposits. (c) 2005 Elsevier B.V. All rights reserved.
机译:研究了电流密度和温度对从无添加剂的氨基磺酸盐浴中电沉积的镍层的显微组织和硬度的影响。结合透射和扫描电子显微镜以及X射线衍射研究了电沉积的微观结构和热稳定性。在横截面上测量维氏显微硬度。本文旨在为以后研究镍(合金)电沉积层的微观结构,硬度和热稳定性的各种强化机理的文章提供参考。 (c)2005 Elsevier B.V.保留所有权利。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号