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首页> 外文期刊>Transactions of the Institute of Metal Finishing: The International Journal for Surface Engineering and Coatings >Influence of MPS concentration on copper electrocrystallisation from acidic sulphate electrolyte with MPS additive systems
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Influence of MPS concentration on copper electrocrystallisation from acidic sulphate electrolyte with MPS additive systems

机译:MPS浓度对带有MPS添加剂体系的酸性硫酸盐电解液中铜电结晶的影响

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摘要

Copper electrocrystallisation on a glassy carbon electrode from acid sulphate electrolytes in the presence of different concentrations of 3-mercapto-1-propanesulphonate sodium salt (MPS) and its combinations with chloride ions (CI) or/and polyethylene glycol (PEG) have been investigated by utilising chronoamperometry (CA) technique and scanning electronic microscopy (SEM). The CA and SEM results indicate that copper nucleation follows instantaneous nucleation with three-dimensional growth (3DI) from all baths at the deposition potentials studied. With increasing MPS concentration, copper nucleation rate and nuclei number density N increase in the MPS, MPS-Cl and MPS-PEG-Cl baths, but decrease in the MPS-PEG bath.
机译:研究了在存在不同浓度的3-巯基-1-丙烷磺酸钠盐(MPS)及其与氯离子(CI)或/和聚乙二醇(PEG)结合的情况下从酸性硫酸盐电解质在玻碳电极上进行铜的电结晶通过使用计时安培(CA)技术和扫描电子显微镜(SEM)。 CA和SEM结果表明,在研究的沉积电位下,铜的成核是瞬时成核,随后在所有镀液中都有三维生长(3DI)。随着MPS浓度的增加,MPS,MPS-Cl和MPS-PEG-Cl镀液中的铜成核速率和核数密度N增大,而MPS-PEG镀液中铜的成核速率和核数密度N减小。

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