ON DIFFUSION BONDING OF Ti-6Al-4V

摘要

Using a specially constructed apparatus diffusion bonding of alloy Ti-6Al-4V was studied in the temperature range 1173 to 1223 K and compressive stress range 12 to 25 MPa to determine the relative importance of the process parameters, the mechanism(s) responsible for bonding and the joint characteristics. Bond quality was assessed by optical metallography and lap shear testing. Sound bonds with no porosity at the interface were produced. The experimental results were compared with a model developed by Pilling (Pilling J, Mater Sci Eng 100 (1988) 137) in which the void closure by superplastic flow, creep flow and diffusion are considered EPMA line scan analysis was carried out to confirm the bonding mechanism.