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Electron-beam curing of a novel liquid crystal thermoset resin

机译:新型液晶热固性树脂的电子束固化

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In this paper we report on the processing and properties of a novel, "dual-curing" liquid crystal (LC) resin cured by electron-beam irradiation. The LC monomer contains both acrylate and acetylene reactive groups. Neat resin samples were e-beam cured in either the LC phase at 65 degreesC or the isotropic phase at 90degreesC. The experimental variables included the total e-beam radiation dose (150 or 250 kiloGray {kGy or J/g}) and thermal post-cure cycle (none or 190degreesC/1 h). Cured polymer specimens were characterized by dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). The results demonstrated that e-beam exposure alone at 150 or 250kGy was not sufficient to fully cure the polymer, although it was sufficient to lock-in the isotropic or LC morphology. Differences in morphology had a significant impact on the DMA and TMA results for non-post-cured specimens, where LC samples demonstrated more robust mechanical properties at elevated temperatures compared to isotropic specimens. After a thermal post-cure cycle the DMA storage modulus differences between the LC and isotropic samples were not as great. However, large differences in thermal expansion coefficients remained. The data suggest the possibility that the acrylate bonds react during e-beam exposure, followed by conversion of the acetylene bonds during the thermal post-cure. Also, e-beam curing in the LC phase likely will allow for tighter molecular packing and more efficient polymerization resulting in higher crosslink densities. (C) 2002 Elsevier Science B.V. All rights reserved. [References: 18]
机译:在本文中,我们报告了通过电子束辐照固化的新型“双固化”液晶(LC)树脂的加工和性能。 LC单体同时包含丙烯酸酯和乙炔反应性基团。将纯树脂样品在65°C的LC相或90°C的各向同性相中进行电子束固化。实验变量包括电子束总辐射剂量(150或250千卡瑞(kGy或J / g))和热固化后周期(无或190摄氏度/ 1小时)。通过动态力学分析(DMA)和热力学分析(TMA)对固化的聚合物样品进行表征。结果表明,仅在150kGy或250kGy下暴露电子束不足以完全固化聚合物,尽管它足以锁定各向同性或LC形态。对于非后固化样品,形态上的差异对DMA和TMA结果有重大影响,与各向同性样品相比,LC样品在高温下表现出更强的机械性能。经过热后固化循环后,LC和各向同性样品之间的DMA储能模量差异不是很大。但是,热膨胀系数仍存在较大差异。数据表明丙烯酸酯键可能在电子束暴露期间发生反应,然后在热后固化过程中发生乙炔键转化。而且,LC相中的电子束固化可能会允许更紧密的分子堆积和更有效的聚合,从而导致更高的交联密度。 (C)2002 Elsevier Science B.V.保留所有权利。 [参考:18]

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