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Ultrahigh Thermal Conductivity of Assembled Aligned Multilayer Graphene/Epoxy Composite

机译:组装的多层石墨烯/环氧树脂复合材料的超高导热系数

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摘要

The exceptional thermal conductivity of gra- phene is expected to endow polymer composites with ultrahigh thermal conductivities, which can be even similar to those of some metals such as stainless steel and aluminum alloy. The thermal conductivities of composites prepared by dispersing multilayer graphene (MLG) in epoxy matrix increase only by an order of magnitude over the pure epoxy. However, the improvement has been limited since the large interfacial thermal resistance exists between graphene and the surrounding epoxy. We have reported an extraordinary increase in thermal conductivity of the MLG/epoxy composites through the fabrication of the vertically aligned and densely packed MLG in the epoxy matrix. The ultrahigh thermal conductivity of 33.54 W/(m IC) has been achieved in the aligned MLG/epoxy composite (AG/E). The thermal conductivity of AG/E exhibits a positive temperature response related to the aligned structure while increasing the temperature from 40 °C to 90 °C.
机译:石墨具有出色的导热性,有望赋予聚合物复合材料以超高的导热率,甚至可以与某些金属(例如不锈钢和铝合金)的导热率相似。通过将多层石墨烯(MLG)分散在环氧基质中制备的复合材料的导热系数仅比纯环氧树脂增加一个数量级。但是,由于石墨烯与周围的环氧树脂之间存在较大的界面热阻,因此改进受到了限制。我们已经报道了通过在环氧树脂基体中垂直排列并密集堆积的MLG的制造,MLG /环氧复合材料的导热系数显着提高。在对齐的MLG /环氧树脂复合材料(AG / E)中已实现33.54 W /(m IC)的超高导热率。 AG / E的热导率表现出与排列结构相关的正温度响应,同时温度从40°C升高到90°C。

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