PEG,PPG,and Their Triblock Copolymers as Suppressors in Copper Electroplating

摘要

Copper electrodeposition from an acidic plating bath is the current method for on-chip production of interconnects for microelectronics.In order to accomplish the superconformal filling necessary to achieve the geometries required by such applications,a series of plating bath additives are utilized.These additives include a promoter,a suppressor,an accelerator,and a leveler.The role of the suppressor is to increase the overpotential required for copper ion reduction by a surface interaction with the promoter.Most studies reported in the literature have explored the effectiveness of polyethylene glycol(PEG)alone.