首页> 外文期刊>Polymer: The International Journal for the Science and Technology of Polymers >FUSION BONDING OF MALEIC ANHYDRIDE GRAFTED POLYPROPYLENE TO POLYAMIDE 6 VIA IN SITU BLOCK COPOLYMER FORMATION AT THE INTERFACE
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FUSION BONDING OF MALEIC ANHYDRIDE GRAFTED POLYPROPYLENE TO POLYAMIDE 6 VIA IN SITU BLOCK COPOLYMER FORMATION AT THE INTERFACE

机译:通过界面上原位嵌段共聚物形成的马来酸酐接枝聚丙烯与聚酰胺6的熔合

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Bond formation between maleic anhydride-g-polypropylene (PPg) and polyamide 6 (PA) by in situ block copolymer formation has been investigated. The effects of bonding temperature and time on the critical strain energy release rate, G(C), of the bonds were studied. The G(C) values were measured using a wedge test in an asymmetric double cantilever beam geometry. Electron spectroscopy for chemical analysis (ESCA) and scanning electron microscopy (SEM) observations of the fracture surfaces were used to provide detailed information on the locus of failure and the failure mechanisms. An increase of G(C) with bonding temperature was observed with two well defined transitions corresponding to the melting temperature of PPg and PA. Below the PPg melting temperature, there is no significant adhesion due to the absence of intimate contact between the adherends. Above this temperature, G(C) increases gradually with temperature. This is explained by the increased mobility of maleic anhydride grafted PP chains which can migrate towards the interface and react with the amine end-groups of the PA. Optimal bonding, however, requires melting of both polymers and results in the highest G(C) values which approach the cohesive G(C) of PPg. Analysis of these fracture surfaces via ESCA and SEM have shown that failure was cohesive in the PPg and accompanied by significant plastic deformation. This is interpreted as saturation of the interface by block copolymer due to the mutual migration of the PA and grafted PP polymer chains that becomes possible when the PA melts. It is suggested that as crystallization proceeds each half of the block copolymer is incorporated into crystalline domains on their respective sides of the interface, producing the highest G(C) values observed. [References: 21]
机译:研究了通过原位嵌段共聚物形成马来酸酐-g-聚丙烯(PPg)和聚酰胺6(PA)之间的键。研究了键合温度和时间对键的临界应变能释放速率G(C)的影响。使用楔形测试在非对称双悬臂梁几何结构中测量G(C)值。用于断裂表面化学分析的电子能谱(ESCA)和扫描电子显微镜(SEM)的观察结果可用于提供有关故障位置和故障机理的详细信息。观察到G(C)随着键合温度的增加而出现了两个明确定义的跃迁,分别对应于PPg和PA的熔融温度。在低于PPg熔融温度下,由于在被粘物之间没有紧密接触,因此没有明显的粘附。高于该温度,G(C)随温度逐渐增加。这可以通过马来酸酐接枝的PP链的增加的迁移率来解释,该PP链可以向界面迁移并与PA的胺端基反应。然而,最佳的结合需要两种聚合物的熔融,并导致最高的G(C)值,接近PPg的内聚性G(C)。通过ESCA和SEM对这些断裂表面的分析表明,PPg的破坏是内聚的,并伴有明显的塑性变形。这被解释为由于PA和接枝的PP聚合物链相互迁移而导致的嵌段共聚物的界面饱和,这在PA熔融时成为可能。建议随着结晶的进行,嵌段共聚物的每一半都在界面各自侧面的结晶域中结合,从而产生最高的G(C)值。 [参考:21]

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