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首页> 外文期刊>Progress in photovoltaics >Experimental Evidence of Parasitic Shunting in Silicon Nitride Rear Surface Passivated Solar Cells
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Experimental Evidence of Parasitic Shunting in Silicon Nitride Rear Surface Passivated Solar Cells

机译:氮化硅背面钝化太阳能电池中寄生分流的实验证据

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Many solar cells incorporating SiN_x films as a rear surface passivation scheme have not reached the same high level of cell performance as solar cells incorporating high-temperature-grown silicon dioxide films as a rear surface passivation. In this paper it is shown by direct comparison of solar cells incorporating the two rear surface passivation schemes, that the performance loss is mainly due to a lower short-circuit current while the open-circuit voltage is equally high. With a solar cell test structure that features a separation of the rear metal contacts from the passivating SiN_x films, the loss in short-circuit current can be reduced drastically. Besides a lower short- circuit current, dark I-V curves of SiN_x rear surface passivated solar cells exhibit distinct shoulders. The results are explained by parasitic shunting of the induced floating junction (FJ) underneath the SiN_x films with the rear metal contacts. The floating junction is caused by the high density of fixed positive charges in the SiN_x films. Other two-dimensional effects arising from the injection level dependent SRV of the Si/SiN_x interfaces are discussed as well, but, are found to be of minor importance. Pinholes in the SiN_x films and optical effects due to a different internal rear surface reflectance can be excluded as a major cause for the performance loss of the SiN_x rear surface passivated cells.
机译:许多将SiN_x薄膜作为背面钝化方案的太阳能电池,其电池性能还没有达到与将高温生长的二氧化硅膜作为背面钝化的太阳能电池相同的电池性能。在本文中,通过直接比较结合了两种背面钝化方案的太阳能电池表明,性能损失主要是由于短路电流较低,而开路电压同样较高。通过以背面金属触点与钝化SiN_x膜分离为特征的太阳能电池测试结构,可以大大减少短路电流的损失。除了较低的短路电流外,SiN_x背面钝化太阳能电池的深色I-V曲线还显示出明显的凸肩。该结果通过具有后金属触点的SiN_x膜下方的感应浮置结(FJ)的寄生分流来解释。浮动结是由SiN_x膜中固定正电荷的高密度引起的。还讨论了由与Si / SiN_x界面有关的取决于注入水平的SRV产生的其他二维效应,但是发现它们的重要性不高。可以排除由于不同的内部后表面反射率而导致的SiN_x膜中的针孔和光学效应,这是导致SiN_x背面钝化单元性能下降的主要原因。

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