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首页> 外文期刊>Proceedings of the Institution of Mechanical Engineers, Part B. Journal of engineering manufacture >Microplasma powder deposition as a new solid freeform fabrication process
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Microplasma powder deposition as a new solid freeform fabrication process

机译:微等离子体粉末沉积作为一种新的固体自由形式制造工艺

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摘要

This paper attempts to apply microplasma powder deposition (MPPD) for solid freeform fabrication (SFF). The relationship between the geometric features of the deposited layers and the welding parameters is investigated. The arc length is controlled through the monitoring of arc voltage. The microstructure and the properties of the deposited layers are analysed. The experimental results show that the MPPD process is a promising welding-based SFF technology that is capable of building relatively small-size parts with low cost. The result of building parts with functionally graded components by the MPPD process is shown as well.
机译:本文尝试将微等离子体粉末沉积(MPPD)应用于固体自由形式制造(SFF)。研究了沉积层的几何特征与焊接参数之间的关系。电弧长度是通过监测电弧电压来控制的。分析了沉积层的微观结构和性能。实验结果表明,MPPD工艺是一种有前途的基于焊接的SFF技术,能够以较低的成本制造相对较小的零件。还显示了通过MPPD流程构建具有功能分级组件的零件的结果。

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