Ever since Schlotter and associates identified and developed organic additives for nickel plating in the 1930s, the process has improved dramatically. Replaced was time consuming buffing to achieve bright nickel deposits. Bright, leveled nickel deposits could now be readily obtained directly from the standard Watts nickel solution. Platers also shared in the joy of using anti pitting agents to prevent gas pitted deposits, which until then were a major problem. The basic or foundation additives for nickel plating have changed very little over the years. During the past decades researchers have found new and "hotter" additives, thus promoting even higher degrees of overall brightness and leveling. At the same time, unique compounds were found to aid in purification and tolerance of the nickel bath to impurities, even to permit production use.
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