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PROCESSING AND CHARACTERIZATION OF CNT/Cu NANOCOMPOSITES BY POWDER TECHNOLOGY

机译:粉末技术处理和表征CNT / Cu纳米复合材料

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Carbon nanotube/copper (CNT/Cu) nanocomposite powders with different volume fractions of multiwall CNTs (MWNTs) are prepared using e electroless Cu deposition method in alkaline citrate bath. The prepared CNT/Cu nanocomposite powders are investigated with HRSEM. The CNT/Cu nanocomposite powders have morphology of implanted CNTs in the copper particles of about 200 nm in size. An electroless deposited pure Cu powder is also prepared by the same method to compare the properties of pure copper samples and the prepared CNT/Cu nanocomposites. The prepared powders undergo XRD and elemental analysis to evaluate the fabricated CNT/Cu nanocomposites. The XRD patterns and elemental analysis inform that the deposited copper is composed of Cu powder and traces of some elements, e.g., sulfur and oxygen. The CNTs/Cu nanocomposite, as well as the pure copper powders, is sintered by spark plasma at 600 deg C and compaction pressure of 20 MPa for one min under 10~(-3) torr vacuum condition. The microstructure of the sintered nanocomposites is investigated with SEM. The CNTs are homogenously distributed in the copper matrix in the case of CNT/Cu nanocomposites with CNT volume fraction up to 10 vol. percent has a porosity of 3 percent, and the porosity increases by increasing CNT volume fraction due to the agglomeration of the CNTs in the copper matrix. The electrical resistivities of the prepared sintered copper and CNT/Cu nanocomposites are measured with four-probe method. The results show that the highest resistivity is 13.5 mu OMEGA centre dot cm for 40 vol. percent CNT/Cu.
机译:采用化学镀铜法在碱性柠檬酸盐浴中制备了具有不同体积分数的多壁碳纳米管(MWNTs)的碳纳米管/铜(CNT / Cu)纳米复合粉末。 HRSEM研究了制备的CNT / Cu纳米复合粉体。 CNT / Cu纳米复合粉末具有在尺寸约200nm的铜颗粒中注入的CNT的形态。还通过相同方法制备了化学沉积的纯铜粉末,以比较纯铜样品和制得的CNT / Cu纳米复合材料的性能。制备的粉末经过XRD和元素分析,以评估所制备的CNT / Cu纳米复合材料。 XRD图谱和元素分析表明,沉积的铜由铜粉和痕量的某些元素(例如硫和氧)组成。 CNTs / Cu纳米复合材料以及纯铜粉在10〜(-3)torr真空条件下,通过火花等离子体在600℃和20 MPa的压制压力下烧结1分钟。扫描电镜观察了纳米复合材料的微观结构。在CNT体积分数高达10体积的CNT / Cu纳米复合材料的情况下,CNT均匀地分布在铜基质中。 %的孔隙率是3%,并且由于铜基体中CNT的团聚,通过增加CNT的体积分数来增加孔隙率。用四探针法测量所制备的烧结铜和CNT / Cu纳米复合材料的电阻率。结果表明,在40 vol时,最高电阻率为13.5μΩOMEGA中心点cm。百分比的CNT / Cu

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