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Eliminating the audible'buzz' in GSM phones: The fully differential amplifier can cancel RF rectification effects and silence cell-phone noise

机译:消除GSM手机中的“嗡嗡声”:全差分放大器可以消除RF整流效果并静音手机噪声

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摘要

Today's cell-phone PCBs are much more complex and internally "noisy" than ever before, due to added functionality and less board space. In many cases, the speaker is very close to the RF antenna, and the audio amplifier is closer to the RF power-amplifier (PA) section. That means the components on the board have to deal with higher levels of RF noise than in previous generations. In many cases, this noise causes RF rectification in the audio amplifier, which results in buzzing or clicking in the speaker. This annoyance has led semiconductor vendors to develop improved audio PAs that offer fully differential architectures with good RF common-mode noise rejection. We'll look at the causes of RF rectification and explain the best architectures for minimizing the problem-in particular Class-AB and Class-D technology with fully differential bridge-tied load (BTL) architectures providing better RF noise immunity compared to the standard master/slave BTL audio amplifiers.
机译:由于增加的功能和更少的电路板空间,今天的手机PCB比以往任何时候都更加复杂和内部“嘈杂”。在许多情况下,扬声器非常靠近RF天线,而音频放大器则更靠近RF功率放大器(PA)部分。这意味着板上的组件必须处理比前几代更高的RF噪声水平。在许多情况下,此噪声会导致音频放大器中的RF整流,从而导致嗡嗡声或扬声器中的咔嗒声。这种烦恼导致半导体供应商开发了改进的音频PA,这些音频PA提供具有良好RF共模噪声抑制能力的全差分架构。我们将研究射频整流的原因,并说明将问题最小化的最佳架构,特别是AB级和D级技术,其全差分桥式负载(BTL)架构与标准相比具有更好的RF噪声抗扰性主/从BTL音频放大器。

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