The properties of tungsten-copper (W-Cul alloys with a Cu content of 20% meet the requirements of designers in electronic applications such as heat sinks, high power diodes, etc. which must provide a combination of low coefficient of thermal expansion (CTE) and good thermal conductivity. W-Cu parts are usually made by Cu infiltration of a pre-sintered W skeleton. The only competitive alternative to Cu-infiltration appears to be pressing and sintering or MIM, if a fine and uniform distribution of a copper phase can be achieved in the sintered material so as to reach the required CTE values.
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