Ultrasonic Imaging Finds Voids,Cracks and Bonding Defects

摘要

As material costs climb,acoustic micro-imaging (AMI) is increasingly being used for non-destructive inspection and quality control of microelectronic components and assemblies,adhesive and welded bonds,solid part walls,and other applications where bond integrity,cracking,or voids are an issue.AMI analyzes the passage of ultra-high-frequency pulses of ultrasound through a material,which can reveal the presence of internal defects.Voids,cracks,and delaminations are usually associated with air gaps that reflect ultrasound at frequencies of 10 to 300 MHz rather than allowing its further transmission.