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Minority carrier blocking to enhance the thermoelectric figure of merit in narrow-band-gap semiconductors

机译:少数载流子阻塞可提高窄带隙半导体的热电性能

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摘要

We present detailed theoretical predictions on the enhancement of the thermoelectric figure of merit by minority carrier blocking with heterostructure barriers in bulk narrow-band-gap semiconductors. Bipolar carrier transport, which is often significant in a narrow-band-gap material, is detrimental to the thermoelectric energy conversion efficiency as it suppresses the Seebeck coefficient and increases the thermal conductivity. When the minority carriers are selectively prevented from participating in conduction while the transport of majority carriers is relatively unaffected by one-sided heterobarriers, the thermoelectric figure of merit can be drastically enhanced. Thermoelectric transport properties such as Seebeck coefficient, electrical conductivity, and electronic thermal conductivity including the bipolar term are calculated with and without the barriers based on the near-equilibrium Boltzmann transport equations under the relaxation time approximation to investigate the effects of minority carrier barriers on the thermoelectric figure of merit. For this, we provide details of carrier transport modeling and fitting results of experimental data for three important material systems, Bi2Te3-based alloys, Mg2Si1-xSnx, and Si1-xGex, that represent, respectively, near-room-temperature (300 K-500 K), midtemperature (600 K-900 K), and high-temperature (> 1000 K) applications. Theoretical maximum enhancement of thermoelectric figure of merit that can be achieved by minority carrier blocking is quantified and discussed for each of these semiconductors.
机译:我们提出了详细的理论预测,以通过体载窄带隙半导体中具有异质结构势垒的少数载流子阻塞来提高热电品质因数。双极性载流子传输通常在窄带隙材料中很重要,因为它抑制塞贝克系数并增加热导率,因此对热电能量转换效率有害。当有选择地阻止少数载流子参与传导,而多数载流子的传输相对不受单面异质势垒的影响时,热电性能因数可以大大提高。根据弛豫时间近似下的近平衡玻尔兹曼输运方程,在有或没有势垒的情况下,计算了包括塞贝克系数,电导率和包括双极项在内的电子热导率在内的热电输运特性,以研究少数载流子势垒对电导率的影响。热电的优点。为此,我们提供了三种重要材料系统Bi2Te3基合金,Mg2Si1-xSnx和Si1-xGex的载流子输运模型和实验数据拟合结果的详细信息,分别代表了接近室温(300 K- 500 K),中温(600 K-900 K)和高温(> 1000 K)应用。对于这些半导体中的每一种,量化和讨论了通过少数载流子阻挡可以实现的热电品质因数的理论上的最大提高。

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