EP29LPSP is a two- component epoxy adhesive/sealant designed to be used in cryogenic applications. It can withstand temperatures as low as 4 K and resist cryogenic shocks (e.g., going from room temperature down to liquid helium temperatures in 5-10 min). This adhesive has a mix ratio of 100:65 by weight and cures at room temperatures with a low exotherm, but best results are obtained if heat-cured at 130-165°F for 6-8 h.
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