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Conference on process and materials characterization and diagnostics in IC manufacturing

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1.Location of Interconnect Defects Using Focused Ion Beam (FIB)-Induced Voltage Contrast and Subsequent In-situ FIB Cross-Sectioning and Auger Electron Analysis in the Physical Electronics 200/300 mm SMART-Tool

机译：互连缺陷的位置使用聚焦离子束（FIB）引起的电压对比度和随后的原位FIB横向和螺旋钻电子分析在物理电子设备200/300mm智能工具中
- 作者：Carolyn F. H. Gondran;Dennis F. Paul;Kenton D. Childs;Laurie G. Dennig;Gregory C. Smith;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- voltage contrast;
- focused ion beam (FIB);
- auger electron spectroscopy (AES);
- full wafer;
2.Development of an Electron Optical System using EB Projection Optics in Reflection Mode for EB Inspection

机译：EB检测中使用EB投影光学系统的电子光学系统的开发
- 作者：Yuichiro Yamazaki;Ichirota Nagahama;Atsushi Onishi;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- projection microscope;
- wafer inspection;
- secondary electron;
- reflection electron;
- charge;
3.Neural Network Based Time Series Modeling of Optical Emission Spectroscopy Data for Fault Detection in Reactive Ion Etching

机译：基于神经网络的基于时间序列建模的反应离子蚀刻故障检测的光发射光谱数据
- 作者：Sang Jeen Hong;Gary S. May;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- RIE;
- OES;
- PCA;
- time series modeling;
- neural networks;
- fault detection;
4.Defect Distribution Model Validation and Effective Process Control

机译：缺陷分配模型验证和有效过程控制
- 作者：Lei Zhongauthor_name/;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- defect;
- distribution validation;
- lognormal;
- process control;
5.Nanovision: a new paradigm for enabling fast optical inspection of nanoscale structures

机译：NanoVision：一种新的范例，用于实现纳米级结构的快速光学检测
- 作者：Michael E. Watts;Rodolfo E. Diaz;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- photonics;
- nanostructures;
- bow tie antenna;
- defect detection;
- electromagnetic scattering;
6.Characterization and Reduction of Copper Chemical Mechanical Polishing Induced Scratches

机译：铜化学机械抛光引起的划痕的特征和减少
- 作者：Tai Yong Teo;Wang Ling Goh;Lup San Leong;Victor Seng Keong Lim;Tak Yan Tse;Lap Chan;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- chemical mechanical polishing;
- copper;
- slurry;
- abrasives;
- alumina;
- silica;
- scratches;
- microscratches;
- defects;
7.In-Line measurement characterization for multi-layers film stack of SiGe by Advance Spetroscopy Ellipsometer

机译：通过预先Spetroscopy椭圆仪的SiGe多层膜叠层的在线测量表征
- 作者：Jay Chen;Arun Srivatsa;Chin Cheng Chien;Tony Liu;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
8.Industry survey on nonvisual defect detection

机译：非缺陷检测行业调查
- 作者：Carol A. Boye
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- Business trends;
- defect classification;
- defect detection;
- yield management;
- non-visual defects;
9.Copy result exactly using EB-Scope technology

机译：复制结果与EB-Scope技术完全相同
- 作者：Keizo Yamada;Takeo Ushiki;Yousuke Itagaki;Robert Newcomb;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
10.Industry Survey on Non-visual Defect Detection

机译：非视缺陷检测行业调查
- 作者：Carol A. Boyeauthor_name/;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- business trends;
- defect classification;
- defect detection;
- yield management;
- non-visual defects;
11.Depth profile characterization of hydrogen implanted silicon using spectroscopic ellipsometry

机译：光谱椭圆形测定法的深度型材表征氢气植入硅
- 作者：Thomas Gubiotti;David Jacy;Ray J. Hoobler;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- thin film;
- metrology;
- ellipsometry;
- SOI;
- depth profile;
- ion beam;
12.COPs/particles discrimination using an automated surface inspection tool

机译：COP /粒子使用自动化表面检测工具辨别
- 作者：Gabriele Lorenzi;Kim Hung Nguyen;Cristina Sanna;Roberta Orizio;Gabriella Borionetti;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- SP1;
- COP;
- crystal defects;
- defects detection;
- defects classification;
- RTDC;
- surface scanning system;
13.In-line e-beam inspection with optimized sampling and newly developed ADC

机译：用优化采样和新开发的ADC在线电子束检测
- 作者：Masami Ikota;Akihiro Miura;Munenori Fukunishi;Takashi Hiroi;Aritoshi Sugimoto;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- e-beam inspection;
- defect;
- voltage contrast;
- auto defect classification (ADC);
14.Semiconductor wafer defect detection using digital holography

机译：半导体晶片缺陷检测使用数字全息术
- 作者：Mark A. Schulze;Martin A. Hunt;Edgar Voelkl;Joel D. Hickson;William Usry;Randall G. Smith;Robert Bryant;C. E. (Tommy) Thomas Jr.;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- digital holography;
- semiconductor wafer defects;
- semiconductor metrology;
- high aspect ratio inspection (HARI);
15.Complete monitoring strategy to quantify matching and performance for multiple CDSEM in advanced fab

机译：完整的监控策略，以在高级工厂中量化多个CDSEM的匹配和性能
- 作者：Pey-Yuan Lee;Chi-Shen Lo;Yi-Hung Chen;Thomas Teng;Steven Fu;Mico Chu;Jason Yee;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- CD SEM;
- CD matching;
- precision;
- carryover;
16.Sidewall structure estimation from CD-SEM for lithographic process control

机译：用于光刻过程控制的CD-SEM侧壁结构估计
- 作者：Philip R. Bingham;Jeffery R. Price;Kenneth W. Tobin;Thomas P. Karnowski;Marylyn H. Bennett;Hal Bogardus;Michael Bishop;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- sidewall structure;
- semiconductor manufacturing;
- content-based image retrieval;
- critical dimension;
17.Spectroscopic Ellipsometric Scatterometry: Sources of Errors in Critical Dimension Control

机译：光谱椭圆散射散射测定法：关键尺寸控制中的误差源
- 作者：Hazart J.;Grand G.;Thony P.;Herisson D.;Garcia S.;Lartigue O.;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- scatterometry;
- CD-control;
- gratings diffraction;
- inverse problems;
18.Advanced ASIC Defect Control

机译：先进的ASIC缺陷控制
- 作者：Chuck May;John Knoch;Roger Young;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- defects;
- system on a chip (SOC);
- yield improvement;
- integrated yield management;
19.Successful Demonstration of a Comprehensive Lithography Defect Monitoring Strategy

机译：综合光刻缺陷监测策略的成功示范
- 作者：Ingrid Peterson;Louis Breaux;Andrew Cross;Mike von den Hoff;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- yield management;
- defect reduction;
20.CD-SEM measurement line edge roughness test patterns for 193 nm lithography

机译：CD-SEM测量线边缘粗糙度测试模式为193 nm光刻
- 作者：Benjamin D. Bunday;Michael Bishop;John S. Villarrubia;Andras E. Vladar
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
21.CD-SEM Measurement of Line Edge Roughness Test Patterns for 193 nm Lithography

机译：193 nm光刻的线边缘粗糙度测试模式的CD-SEM测量
- 作者：Benjamin D. Bunday;Michael Bishop;John S. Villarrubia;Andras E. Vladar;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
22.Intentional Defect Array Wafers; Their practical use in Semiconductor control and monitoring systems

机译：故意缺陷阵列晶片;它们在半导体控制和监控系统中的实际应用
- 作者：Iraj Emami;Mike McIntyre;Michael Retersdorf;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
23.LithoCell-Integrated Critical Dimension Metrology

机译：Lithocell-集成的关键维度计量
- 作者：J. Broc Stirton;Clint Miller;Anita Viswanathan;Makoto Miyagi;Lawrence Lane;Michael Laughery;Tarun Parikh;KC Chan;Apo Sezginer;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- scatterometry;
- integrated metrology;
24.X-ray reflectivity: a new metrology alternative for DUV ARCs

机译：X射线反射率：DUV弧的新计量替代品
- 作者：Dileep Agnihotri;Derek Calhoun;Joseph Formica;Joseph Harmon;Lance Nevala;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- anti-reflective;
- ARC;
- DUV;
- metrology;
- reflectivity;
- reflectometry;
- SiO_2;
- SiON;
- x-ray;
- XRR;
25.Novel Technique for Contamination Analysis around the Edge, the Bevel, and the Edge Exclusion Area of 200 and 300mm Silicon Wafers

机译：围绕边缘，斜面和边缘排除面积200和300mm硅晶片的污染分析新技术
- 作者：Chris M. Sparks;Carolyn F. H. Gondran;Patrick S. Lysaght;John T. Donahue;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on process and materials characterization and diagnostics in IC manufacturing》 | 2003年
- trace metals;
- contamination;
- wafer bevel analysis;
- wafer edge exclusion analysis;