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Multilevel Interconnection: Issues That Impact Competitiveness

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1.Increasing the accuracy of lifetime predictions from accelerated electromigration tests

机译：通过加速的电迁移测试提高寿命预测的准确性
- 作者：Tim E. Turner;Turner Engineering Technology;Roanoke;TX;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
2.Advanced techniques for interlayer dielectric deposition and planarization

机译：层间电介质沉积和平面化的先进技术
- 作者：Justin K. Wang;Lam Research Corp.;Fremont;CA;USA;Dean R. Denison;Lam Research Corp.;Fremont;CA;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
3.Development of reliable multilayer metallization for submicron ULSI technology

机译：开发用于亚微米ULSI技术的可靠多层金属镀层
- 作者：Arthur T. Kuo;LSI Logic Corp.;Santa Clara;CA;USA;Ratan K. Choudhury;LSI Logic Corp.;Santa Clara;CA;USA;William Hata;LSI Logic Corp.;Santa Clara;CA;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
4.Confinement effects of oxide overlayers on the stress and yield behavior of Al alloys

机译：氧化物覆盖层对铝合金应力和屈服行为的约束作用
- 作者：Steven G. Anderson;Univ. of Texas/Austin;Austin;TX;USA;I.S. Yeo;Univ. of Texas/Austin;Austin;TX;USA;D.Jawarani;Univ. of Texas/Austin;Austin;TX;USA;Paul S. Ho;Univ. of Texas/Austin;Austin;TX;USA;Sesh Ramaswami;Advanced Micro Devices;I
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
5.Reactively sputtered coherent TiN process for sub-0.5-um technology

机译：0.5微米以下技术的反应溅射相干TiN工艺
- 作者：Girish A. Dixit;Texas Instruments Inc.;Dallas;TX;USA;Peter J. Wright;Texas Instruments Inc.;Dallas;TX;USA;S.Poarch;Texas Instruments Inc.;Dallas;TX;USA;R.H. Havemann;Texas Instruments Inc.;Dallas;TX;USA;K.Ngan;Applied Materials;Inc.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
6.Barrier layer metallization schemes for ULSI technologies

机译：ULSI技术的阻挡层金属化方案
- 作者：Gurtej S. Sandhu;Micron Semiconductor;Inc.;Boise;ID;USA;Scott Meikle;Micron Semiconductor;Inc.;Boise;ID;USA;Sung Kim;Micron Semiconductor;Inc.;Boise;ID;USA;Trung T. Doan;Micron Semiconductor;Inc.;Boise;ID;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
7.Extending resist-etch-back planarization to 0.5-um logic and ASIC circuits

机译：将抗蚀剂回蚀平面化扩展到0.5um逻辑和ASIC电路
- 作者：Ted R. White;Motorola;Austin;TX;USA;W.J. Ciosek;Motorola;Austin;TX;USA;E.J. Prinz;Motorola;Austin;TX;USA;Charles F. King;Motorola;Austin;TX;USA;R.Blumenthal;Motorola;Austin;TX;USA;Charles W. Stager;Motorola;Austin;TX;USA;B.M.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
8.Spin on glass (SOG) etch-back planarization process: an industrial solution for 0.5-um CMOS TLM technology

机译：旋涂玻璃（SOG）回蚀平面化工艺：0.5um CMOS TLM技术的工业解决方案
- 作者：Pascale Molle;CENG-LETI-STME;Grenoble cedex;France;H.Ullman;SGS-Thomson Microelectronics;Grenoble Cedex;France;B.Gros;SGS-Thomson Microelectronics;Grenoble Cedex;France;P.Fugier;CENG-LETI-STME;Grenoble cedex;France;O.Demolliens;CENG-LETI-
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
9.Slurry chemistry effects during chemical-mechanical polishing of silicon oxide films

机译：氧化硅膜化学机械抛光过程中的浆料化学效应
- 作者：Rahul Jairath;SEMATECH;Austin;TX;USA;Hubert M. Bath;SEMATECH;Austin;TX;USA;Suzanne Davis;SEMATECH;Austin;TX;USA;M.Desai;SEMATECH;Hopewell Junction;NY;USA;Kathleen Perry;SEMATECH;Austin;TX;USA;Siva Sivaram;SEMATECH;Austin;TX;US
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
10.Simulations of metallization uniformity from large planar sputtering targets

机译：大型平面溅射靶材金属化均匀度的仿真
- 作者：Fred Bouchard;Tosoh SMD;Grove City;OH;USA;W.A. Manring;Tosoh SMD;Grove City;OH;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
11.Temperature measurements on metallic lines under current stresses by laser probing and correlation with electromigration tests at wafer level

机译：通过激光探测在电流应力下测量金属线上的温度，并与晶圆级的电迁移测试相关
- 作者：W.Claeys;Univ. de Bordeaux I;Talence Cedex;France;Francois Giroux;SGS-Thomson Microelectronics;Grenoble Cedex;France;S.Dilhaire;Univ. de Bordeaux I;Talence Cedex;France;C.Gounelle;SGS-Thomson Microelectronics;Grenoble Cedex;France;V.Quinta
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
12.Wafer level reliability: competitiveness and implementation issues

机译：晶圆级可靠性：竞争力和实施问题
- 作者：Jeff S. May;SGS-Thomson Microelectronics;Carrollton;TX;USA;Hoang H. Hoang;SGS-Thomson Microelectronics;Carrollton;TX;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
13.Yield and reliability of laser-formed vertical links

机译：激光成型垂直连杆的产量和可靠性
- 作者：Hans-Dieter Hartmann;SICAN GmbH;Hannover;Federal Republic of Germany;Thomas Hillmann-Ruge;Univ. Hannover;Hannover;Federal Republic of Germany.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
14.Interaction between photoresist pretreatment and high-aspect-ratio contact and via hole definition

机译：光刻胶预处理与高纵横比接触和通孔定义之间的相互作用
- 作者：Kevin C. Brown;National Semiconductor Corp.;Santa Clara;CA;USA;Linda J. Insalaco;Fusion Semiconductor Systems;Rockville;MD;USA;Elina C. Szeto;Lam Research Corp.;Fremont;CA;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
15.Application of APCVD TEOS/ozone thin films in < 0.5-um IC fabrication:trench and intermetal dielectric isolation and gap fill,

机译：APCVD TEOS /臭氧薄膜在<0.5um的IC制造中的应用：沟槽和金属间电介质隔离以及间隙填充，
- 作者：Jeff P. West;Motorola;Austin;TX;USA;H.W. Fry;Watkins-Johnson Co.;Scotts Valley;CA;USA;Steve Poon;Motorola;Austin;TX;USA;B.A. Boeck;Motorola;Austin;TX;USA;C.C. Yu;Motorola;Austin;TX;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
16.Application of APCVD TEOS/ozone thin films in < 0.5-um IC fabrication: trench and intermetal dielectric isolation and gap fill

机译：APCVD TEOS /臭氧薄膜在小于0.5um的IC制造中的应用：沟槽和金属间电介质隔离以及间隙填充
- 作者：Author(s): Jeff P. West Motorola Austin TX USA;H.W. Fry Watkins-Johnson Co. Scotts Valley CA USA;Steve Poon Motorola Austin TX USA;B.A. Boeck Motorola Austin TX USA;C.C. Yu Motorola Austin TX USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
17.Effects of ILD thickness and slope-etch depth on via performance and metal filling characteristics

机译：ILD厚度和倾斜蚀刻深度对通孔性能和金属填充特性的影响
- 作者：Gregory W. Grynkewich;Motorola;Mesa;AZ;USA;John L. Freeman;Motorola;Mesa;AZ;USA;Wayne K. Morrow;Motorola;Mesa;AZ;USA;Ping Wang;Motorola;Mesa;AZ;USA;Robert Woodburn;Motorola;Mesa;AZ;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
18.Process integration issues in chemical-vapor-deposited co

机译：化学气相沉积钴的工艺集成问题
- 作者：Ajay Jain;Univ. of New Mexico;Albuquerque;NM;USA;Toivo T. Kodas;Univ. of New Mexico;Albuquerque;NM;USA;Rahul Jairath;National Semiconductor Corp.;Austin;TX;USA;Mark J. Hampden-Smith;Univ. of New Mexico;Albuquerque;NM;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
19.Simplified air bridge technique using photoresist UV stabilization process

机译：使用光刻胶紫外线稳定工艺的简化气桥技术
- 作者：James Tajadod;Burlington Semiconductor Operations;Burlington;MA;USA;Linda J. Insalaco;Fusion Semiconductor Systems;Rockville;MD;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
20.Properties of silicon oxide deposited by electron-cyclotron-resonance plasma-enhanced chemical vapor deposition

机译：电子回旋共振等离子体增强化学气相沉积法沉积氧化硅的性质
- 作者：Burt W. Fowler;SEMATECH;Austin;TX;USA;David Stark;SEMATECH;Austin;TX;USA;J.Xie;SEMATECH;Austin;TX;USA;P.McDonald;SEMATECH;Austin;TX;USA;Ronald A. Carpio;SEMATECH;Austin;TX;USA;S.Akbar;SEMATECH;Austin;TX;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
21.Spin on glass (SOG)-based planarization scheme compatible with a stacked via multilevel metal process

机译：基于旋涂玻璃（SOG）的平面化方案与通过多层金属工艺堆叠的工艺兼容
- 作者：Maurizio Bacchetta;SGS-Thomson Microelectronics;Agrate Brianza;Milano;Italy;Laura Bacci;SGS-Thomson Microelectronics;Agrate Brianza;Milano;Italy;Nadia Iazzi;SGS-Thomson Microelectronics;Agrate Brianza Milano;Italy;I.Liles;SGS-Thomson Microe
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
22.Statistical reliability control from an IC user's perspective

机译：从IC用户的角度进行统计可靠性控制
- 作者：Mark J. Berg;Seagate Technology;Bloomington;MN;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
23.Triple-level metal process for high-performance and high-density 0.6-um/5-V a

机译：三级金属工艺，可实现高性能和高密度0.6-um / 5-V a
- 作者：S.Prasad;LSI Logic Corp.;Fremont;CA;USA;M.Bruner;LSI Logic Corp.;Santa Clara;CA;USA;Fusen E. Chen;LSI Logic Corp.;Santa Clara;CA;USA;Mitan Gandhi;LSI Logic Corp.;Milipitas;CA;USA;Y.C. Lu;LSI Logic Corp.;Santa Clara;CA;USA;Chiyi Y.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
24.Investigation of latch-up phenomenon in sea-of-gate ASIC devices

机译：门海ASIC器件中的闩锁现象研究
- 作者：Tam T. Le;SGS-Thomson Microelectronics;Carrollton;TX;USA;D.Mainz;SGS-Thomson Microelectronics;Carrollton;TX;USA;R.Torres;SGS-Thomson Microelectronics;Carrollton;TX;USA;J.Kinney;SGS-Thomson Microelectronics;Carrollton;TX;USA;B.Glenn;SG
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年
25.Elimination of stress-induced voids on AlCu multilevel interconnect lines

机译：消除AlCu多级互连线上的应力引起的空隙
- 作者：Gordon Grivna;Motorola;Tempe;AZ;USA;John L. Freeman;Motorola;Mesa;AZ;USA;Clarence J. Tracy;Motorola;Mesa;AZ;USA.
- 会议名称：《Multilevel Interconnection: Issues That Impact Competitiveness》 | 1993年