Novel sensor process enables SWIR and visible light capture on single chip

摘要

Shifting to a Cu-Cu hybridization process also allows the InGaAs sensor to output a digital signal without the use of a digital conversion circuit. This both simplifies design and gives SWIR cameras using this technology the same performance as current industrial CMOS sensors. Hyperspectral and SWIR imaging technologies deliver significant benefits in food and agriculture for quality inspection and con tamination detection but can also be deployed across a wide range of industries -from art restoration to medicine to automotive. By replacing bump connections with Cu-Cu bonding, it becomes possible to significantly improve on legacy InGaAs image sensor limitations. This includes quadrupling the pixel density, enabling SWIR and visible light capture on a single chip, and delivering a digital output.