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Effects of Atomic Weight, Gas Pressure, and Target-to-substrate Distance on Deposition Rates in the Sputter Deposition Process

机译:溅射沉积过程中原子量,气压和靶到基板距离对沉积速率的影响

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摘要

The target-to-substrate(T-S)distance systematically along with the gas pressure and target element. The deposition rate showed power-law decay with the T-S distance, and the slope of the log-log plot became steep at a transition pressure. The transition pressure decreased as the mass of the sputtered atoms decreased, which suggested that the transition was related to the transport of the sputtered atoms and their thermalization. Two separated thickness monitors showed that the thickness uniformity was worsened by the thermalization.
机译:靶与底物(T-S)的距离以及气压和目标元素的分布是系统的。沉积速率显示出随T-S距离的幂律衰减,对数-对数图的斜率在转变压力下变得陡峭。随着溅射原子质量的降低,转变压力降低,这表明该转变与溅射原子的传输及其热化有关。两个分开的厚度监测器显示,厚度均匀性因热化而变差。

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  • 来源
    《真空》 |2014年第4期|152-154|共3页
  • 作者单位

    Department of Materials and Life Science, Seikei University, 3 Kichijoji Kita, Musashino-shi, Tokyo 180-8633, Japan;

    Department of Materials and Life Science, Seikei University, 3 Kichijoji Kita, Musashino-shi, Tokyo 180-8633, Japan;

    Department of Materials and Life Science, Seikei University, 3 Kichijoji Kita, Musashino-shi, Tokyo 180-8633, Japan;

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