首页> 外文期刊>日本機械学会論文集. A編 >Fracture Mechanics Approach into the Crack Growth of Si_3N_4 under Ball-on-Plate Contact (Surface Crack Growth Behavior in the Center of the Contact Area)
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Fracture Mechanics Approach into the Crack Growth of Si_3N_4 under Ball-on-Plate Contact (Surface Crack Growth Behavior in the Center of the Contact Area)

机译:板对球接触下Si_3N_4裂纹扩展的断裂力学方法(接触区中心处的表面裂纹扩展行为)

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Surface crack growth behavior of a Si_3N_4 plate from small pre-indentations located in the contact center was investigated under ball-on-plate contact. Near surface stresses under the spherical Hertzian contact were calculated by the Hanson's analytical solution. The crack growth behavior was discussed in terms of the calculated stresses and the stress intensity factors both under rolling contact and under sliding-including-rolling contact. The cracks were observed to grow only in a direction perpendicular to the motion of the ball. The maximum value of K_I K_Imax, was found to remain constant during the crack growth. The stress intensity factor ranges, ΔK_II and ΔK, on the other hand, increase with the increase in crack length both under rolling contact and under sliding- including-rolling contact. All the stress intensity factors were increased by the friction force. It was found that the crack growth is controlled by K_Imax combined with ΔK_II and ΔK_III. It was also found that the crack growth is promoted by the increased K_Imax, ΔK_II and ΔAK_III by the friction force under sliding-including-rolling contact.
机译:在球对板接触下,研究了位于接触中心的小预刻痕导致的Si_3N_4板的表面裂纹扩展行为。通过Hanson的解析解计算球形Hertzian接触下的近表面应力。根据计算得出的应力和在滚动接触和滑动-包括-滚动接触下的应力强度因子,讨论了裂纹扩展行为。观察到裂纹仅在垂直于球运动的方向上增长。发现在裂纹扩展期间,K_I K_Imax的最大值保持恒定。另一方面,在滚动接触和包括滑动-滚动接触的情况下,应力强度因子范围ΔK_II和ΔK随裂纹长度的增加而增加。所有应力强度因子均因摩擦力而增加。发现裂纹扩展受K_Imax结合ΔK_II和ΔK_III的控制。还发现,在包括滑动-滚动接触下的摩擦力下,K_Imax,ΔK_II和ΔAK_III的增加促进了裂纹的扩展。

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