円錐圧子押込みにおける基板効果を利用した薄膜材料の塑性特性同定法

摘要

半導体配線のような薄膜/基板材料の機械的特性のrnin-situ計測法として，ナノ計装押込試験による方法が有力視されている．近乾均質バルレク材への押込みに関するrn研究が進ん結果，荷重一押込深さ関係から弾塑性特性rnを抽出する方法について，現在ではほぼ確立されたといrnえる．%A new identification method with microano-indentation for plastic material parameters of film/substrate system is presented. The method is based on extensive finite element computation on, "soft film on hard substrate" cases indented with cone. The method also utilizes the substrate effect on load versus depth relation in the indentation, this effect has often been regarded as undesirable. The computational results were expressed as a response surface in a material parameter space. Based on the surface, and employing experimentally obtained load versus depth relation, the plastic material parameters of the film are identified. A numerical example determined by this method for different plastic properties of film/substrate system is given.