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Electro-fragmentation Analysis Of Dielectric Thin Films On Flexible Polymer Substrates

机译:柔性聚合物基底上介电薄膜的电碎化分析

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An electro-fragmentation method was developed as a fast alternative to the time consuming fragmentation test carried out in situ in a microscope, to investigate the failure of dielectric inorganic coatings on polymer substrates. An ultrathin conductive layer was used to probe the onset of tensile failure in the dielectric coating through changes of its electrical resistance. A careful selection of the conductive layer has been carried out to avoid artifacts resulting for instance from a change of the cohesive properties (e.g. internal stress state) of the investigated structures. Au layers were found to be too ductile, contrary to Al-Ti layers that were too brittle, which invalidated the use of both materials to probe the failure of the dielectric coatings. In contrast, for structures on high-temperature polymer substrates, a 10 nm thick amorphous graphite (a-G) layer was found to accurately reproduce the cracking of the coating. The Young's modulus and coefficient of thermal expansion of the a-G layer are low enough not to impact the internal strain, hence the crack onset strain of the dielectric coating. The a-G layer is also sufficiently brittle, and its cohesive failure and resulting increase of electrical resistance is triggered by the failure of the dielectric coating. The a-G electro-fragmentation method is presently limited to polymers substrates with a glass-transition temperature higher than 100 ℃.
机译:为了研究聚合物基体上介电无机涂层的失效,开发了一种电子碎裂方法,以替代耗时的在显微镜下进行的碎裂测试。使用超薄导电层通过改变其电阻来探测介电涂层中拉伸破坏的开始。已经对导电层进行了仔细的选择以避免产生例如由于所研究结构的内聚性(例如内应力状态)的改变而导致的伪影。发现Au层太易延展,而Al-Ti层太脆,这使使用这两种材料来探测介电涂层的失效无效。相反,对于高温聚合物基材上的结构,发现10 nm厚的无定形石墨(a-G)层可以准确地再现涂层的裂纹。 a-G层的杨氏模量和热膨胀系数足够低而不会影响内部应变,因此不会影响介电涂层的裂纹起始应变。 a-G层也足够脆,并且由于电介质涂层的破坏而引起其内聚破坏和由此引起的电阻增加。 a-G电碎裂方法目前仅限于玻璃化转变温度高于100℃的聚合物基材。

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