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Preferential growth transformation of Bi_(0.5)Sb_(1.5)Te_3 films induced by facile post-annealing process: Enhanced thermoelectric performance with layered structure

机译:便捷的后退火工艺诱导的Bi_(0.5)Sb_(1.5)Te_3薄膜的优先生长转变:具有分层结构的增强的热电性能

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摘要

Preferential growth transformation from (015) plane to (00l) plane of the bismuth antimony tellurium (Bi_(0.5)Sb_(1.5)Te_3) film has been achieved through a facile post-annealing process with enhanced thermoelectric performance. The Bio.5Sb1.5Te3 film with preferential growth of (015) crystal plane was obtained via dc magnetron sputtering, and the Stranski-Krastanov model has been used to explain its growth mechanism. Preferential growth transformation from (015) plane to (001) plane occurred after a post-annealing process. The driving force of this phenomenon is the natural tendency to reduce the total interfacial energy of the system, and the migration and coalescence of atoms along the in-plane direction form the layered structure. Moreover, the carrier concentration of Bi_(0.5)Sb_(1.5)Te_3 films is optimized to ~0~(19)/cm~3 in the film with preferential growth of (001) plan. Hence, a synchronous increase of electrical conductivity and Seebeck coefficient is obtained due to the greatly enhanced carrier mobility and optimized carrier concentration. Therefore, the Bi_(0.5)Sb_(1.5)Te_3 film with the preferential growth of (001) plane possesses power factor of 48.2 μW/cm K~2 which is three times higher than that of the film with the preferential growth of (015) plane. Our study has provided a facile strategy to induce preferential growth transformation in Bi_(0.5)Sb_(1.5)Te_3 films and meanwhile largely enhanced the thermoelectric performance.
机译:铋锑碲(Bi_(0.5)Sb_(1.5)Te_3)薄膜从(015)面到(00l)面的优先生长转变已通过一种易于实现的,具有增强的热电性能的后退火工艺实现。通过直流磁控溅射获得了优先生长(015)晶面的Bio.5Sb1.5Te3薄膜,并用Stranski-Krastanov模型来解释其生长机理。在退火后过程中发生了从(015)面到(001)面的优先生长转变。这种现象的驱动力是减少系统总界面能的自然趋势,原子沿平面内方向的迁移和聚结形成分层结构。此外,Bi_(0.5)Sb_(1.5)Te_3薄膜的载流子浓度在(001)计划优先生长的薄膜中被优化为〜0〜(19)/ cm〜3。因此,由于大大提高了载流子迁移率和优化了载流子浓度,因此获得了电导率和塞贝克系数的同步增加。因此,优先生长为(001)平面的Bi_(0.5)Sb_(1.5)Te_3薄膜的功率因数为48.2μW/ cm K〜2,是优先生长为(015)的薄膜的三倍。 )平面。我们的研究提供了一种可行的策略来诱导Bi_(0.5)Sb_(1.5)Te_3薄膜中的优先生长转变,同时大大提高了热电性能。

著录项

  • 来源
    《Thin Solid Films》 |2014年第1期|270-276|共7页
  • 作者单位

    Beijing Key Laboratory for Advanced Functional Materials and Thin Film Technology, School of Materials Science and Engineering, Beihang University, Beijing, 100191, China;

    Beijing Key Laboratory for Advanced Functional Materials and Thin Film Technology, School of Materials Science and Engineering, Beihang University, Beijing, 100191, China;

    Beijing Key Laboratory for Advanced Functional Materials and Thin Film Technology, School of Materials Science and Engineering, Beihang University, Beijing, 100191, China;

    Beijing Key Laboratory for Advanced Functional Materials and Thin Film Technology, School of Materials Science and Engineering, Beihang University, Beijing, 100191, China;

    Beijing Key Laboratory for Advanced Functional Materials and Thin Film Technology, School of Materials Science and Engineering, Beihang University, Beijing, 100191, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Thermoelectric properties; Thin films; Sputtering; Bismuth antimony telluride; Preferential growth; Thermoelectric performance;

    机译:热电性能;薄膜;溅射;碲化铋锑;优先增长;热电性能;

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