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Challenges in the industrial deposition of transparent conductive oxide materials by reactive magnetron sputtering from rotatable targets

机译:可旋转靶材通过反应磁控溅射在工业上沉积透明导电氧化物的挑战

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摘要

Reactive magnetron sputter deposition of transparent conductive oxides (TCOs) is a cost effective deposition technique due to low target costs compared to ceramic processes. Rotatable tube targets are used in industries because of their high material reservoir and a high target utilization (approx. factor 2 compared to planar targets). Another advantage for reactive sputtering is the absence of erosion groves. However, the reactive sputter process is highly complex because nearly any process parameter has strong impact on the properties of the growing film. Thus, the variation of the working point along the tube target may cause serious problems, in particular because conductivity, transparency, and thickness have to be optimized over a large substrate area at the same time. The most commonly sputtered TCO materials are aluminium doped zinc oxide and indium tin oxide. The respective reactive sputter processes are very distinct. This concerns among others the possible process control mechanisms as well as the dependence of the film properties on the reactive working point The reliable industrial application of the reactive TCO sputter processes is still a big challenge for large area substrates. There are different possibilities to control the sputter process as well as the film properties in situ. (C) 2017 Elsevier B.V. All rights reserved.
机译:透明导电氧化物(TCO)的反应磁控溅射沉积是一种具有成本效益的沉积技术,因为与陶瓷工艺相比目标成本较低。可旋转管式靶材因其高的材料储量和较高的靶材利用率(与平面靶材相比约为2倍)而被用于工业中。反应溅射的另一个优点是没有腐蚀槽。但是,反应溅射工艺非常复杂,因为几乎任何工艺参数都会对生长薄膜的性能产生重大影响。因此,沿着管靶的工作点的变化可能引起严重的问题,特别是因为必须同时在较大的基板面积上优化电导率,透明度和厚度。最常用的溅射TCO材料是掺杂铝的氧化锌和氧化铟锡。各个反应溅射工艺非常不同。这尤其涉及可能的工艺控制机制以及薄膜性质对反应性工作点的依赖性。反应性TCO溅射工艺的可靠工业应用仍然是大面积基板的一大挑战。存在控制溅射过程以及原位膜特性的不同可能性。 (C)2017 Elsevier B.V.保留所有权利。

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