Influence of Thermal Spikes on the Ageing of Adhesively Bonded Structures - A Dielectric Study

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Influence of Thermal Spikes on the Ageing of Adhesively Bonded Structures - A Dielectric Study

机译：热尖峰对粘合结构老化的影响-介电研究

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《The Journal of Adhesion 》 |2008年第3期| p.193-211| 共19页
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正文语种 eng
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Adhesive bonding; Aluminium epoxy joints; Dehydration effects; Dielectric relaxation; Hydrolytic ageing; Spiked temperature studies;

机译：粘接;铝环氧树脂接头;脱水作用;介电弛豫;水解老化;尖峰温度研究;

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1. Influence of Thermal Spikes on the Ageing of Adhesively Bonded Structures - A Dielectric Study [J] . B. K. McConnell, R. A. Pethrick The Journal of Adhesion . 2008 ,第1a3期

机译：热尖峰对粘合结构老化的影响-介电研究
2. Dielectric studies of ageing in aluminium epoxy adhesively bonded structures: design implications [J] . S T Halliday, W M Banks, R A Pethrick Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications . 1999 ,第2期

机译：铝环氧胶粘结构中的老化介电研究：设计意义
3. Influence of short‑time thermal ageing on the behaviour of double lap composite adhesively bonded joints [J] . Joseph El Hage, Georges Challita, Julien Capelle, SN Applied Sciences . 2020 ,第10期

机译：短时间热老化对双圈复合粘合接头行为的影响
4. Application of dielectric analysis to the study of ageing in adhesive bonded structures [C] . Richard A.Pethrick, Sadanand B.Joshi, D.avid Hayward, Symposium on nondestructive characterization of materials in aging systems . 1998

机译：介电分析在粘接结构中老化研究的应用
5. A Numerical and Experimental Study of Adhesively Bonded Repairs of Aluminum Fuselage Structures Using Aluminum and Composite Patches [D] . Chadha, Reewanshu 2018

机译：用铝和复合材料修补铝制机身结构的数值和实验研究
6. Microstructure Evolution and the Resulted Influence on Localized Corrosion in Al-Zn-Mg-Cu Alloy during Non-Isothermal Ageing [O] . Jun-Zhou Chen, Guo-Ai Li, Xin Cai, 2018

机译：Al-Zn-Mg-Cu合金非等温时效过程中的组织演变及其对局部腐蚀的影响
7. Study on Estimation Method with Respect to Width of Non-adhesive Area in CFRP-SS400 Bonded Structure by Thermal Testing Method and FEM - Derivation of Estimation Equation for Width of Non-adhesive Area - [O] . 倉橋貴彦, 大屋秀顕, 大平拓郎, 2014

机译：CFRP-SS400粘结结构非粘结区宽度估算方法的热试验与有限元研究-非粘结区宽度估算公式的推导-
8. Development of a Dielectric Based Non-Destructive Examination Method for Adhesive Bonded Structures: A Fundamental Study. Investigation of Dielectric Methods for the Characterization of Adhesive Bonded Structures [R] . Pethrick, R. A. , Hayward, D. 2000

机译：基于介电的粘接剂结构无损检测方法的发展：一项基础研究。粘接剂结构表征的介电方法研究

Influence of Thermal Spikes on the Ageing of Adhesively Bonded Structures - A Dielectric Study

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