Designing In Thermal Management

摘要

In the case of mixed-signal, analog, and mostly analog boards, special attention must go to careful thermal analysis. The PCB designer performing the thermal analysis must best to deploy certain design steps and techniques to maximize heat dissipation through component and board levels.rnThermal management determines and implements methods to transfer the heat PCB components generate away those devices to other sides of the board or eventually into the ambient. Historically, the well-proven heat sink has been the stalwart for board heat dissipation. Today, thanks to new technologies, it continues to dissipate even greater heat more efficiently.