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Single-crystalline Si nanowires fabrication by one-step metal assisted chemical etching: The effect of etching time and resistivity of Si wafer

机译:一步金属辅助化学刻蚀制备单晶硅纳米线:刻蚀时间和硅片电阻率的影响

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摘要

The one-step metal assisted chemical etching (1-MACE) of p-Si wafers with different resistivities and etching time in HF/AgNO3/H2O2 aqueous solution, resulted in large-area vertical Si nano wires (SiNWs). The field emission scanning electron microscopy (FESEM), and transmission electron microscopy (TEM) revealed that the diameters and lengths of nanowires are decreased with increasing the doping level of Si wafer, while their roughness and porosity are increased. The selected area electron diffraction (SAED) patterns showed that SiNWs retain their single crystal structure of starting wafers. The reflectance spectra indicated that the etched samples have a very low reflectance (0.1% and less) in the visible range acting as an anti-reflecting and high absorption layer in solar cells. Furthermore, broadband PL emissions are observed only in samples etched for 60 and 80 min, that are well consistent with the TEM images and Raman shift spectra analysis considering the formation of Si nanocrystals (SiNCs) (similar to 2.3-3.5 nm) decorated on the sidewalls of the nanowires.
机译:在HF / AgNO3 / H2O2水溶液中对电阻率和蚀刻时间不同的p-Si晶片进行一步金属辅助化学蚀刻(1-MACE),得到大面积的垂直Si纳米线(SiNWs)。场发射扫描电子显微镜(FESEM)和透射电子显微镜(TEM)表明,纳米线的直径和长度随着硅片掺杂水平的增加而减小,而其粗糙度和孔隙率则增大。所选区域电子衍射(SAED)图案表明SiNW保留了起始晶片的单晶结构。反射光谱表明,蚀刻后的样品在可见光范围内具有非常低的反射率(0.1%或更低),可作为太阳能电池中的抗反射和高吸收层。此外,仅在蚀刻60和80分钟的样品中观察到宽带PL发射,这与TEM图像和拉曼位移光谱分析非常吻合,考虑到装饰在硅片上的Si纳米晶体(SiNCs)(类似于2.3-3.5 nm)的形成。纳米线的侧壁。

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