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Investigation of barrier inhomogeneities in I-V and C-V characteristics of Ni-TiO_2/p-Si/Al heterostructure in wide temperature range

机译:Ni / n-TiO_2 / p-Si / Al异质结构在宽温度范围内的I-V和C-V特性的势垒不均匀性研究

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In this study, we report on the growth and electrical characterization of Ni-TiO2/p-Si/Al heterojunction. A thin layer of TiO2 was deposited on p-Si by pulsed layer deposition technique. Highly pure nickel and aluminum metals were deposited by thermal coating system to make the contacts to n-TiO2 and p-Si, respectively. The pulsed laser ablation processed Ni-TiO2/p-Si/Al heterojunction exhibits good rectifying properties over the wide range of temperature between 80 K and 300 K. The X-ray diffraction (XRD) investigations have confirmed the epitaxial growth of the TiO2 films which are highly oriented nanocrystals with particle size of 43.3 nm. The optical energy band gap of TiO2 thin films was studied using UV-VIS spectroscopy and Tauc plots, which comes out to be 3.20 eV. Atomic force microscopy study of the surface morphology reveals that the surface is reasonably smooth, homogeneous and the roughness is of nanometer order. The dominating current transport mechanisms through the heterojunction were investigated in forward and reverse bias current-voltage (I-V) measurements. The current transport mechanisms are strong functions of temperature and successfully explained using thermionic emission diffusion (TED) mechanism with Gaussian distributions of barrier heights. The dependence of barrier height on temperature and the non-linearity of activation energy plot have confirmed that barrier heights at n-TiO2/p-Si interface follow the Gaussian distributions. The mean value of barrier height and standard deviation were found to be 0.79 eV and 0.10 V, respectively. The effective resistance of the heterojunction plays an important role in the I-V characteristics as well as in rectifying properties. The barrier heights as a function of temperature were also studied from reverse biased capacitance-voltage (C-V) characteristics. The discrepancy between the barrier heights calculated from I-V and C-V measurements has been attributed to the existence of barrier inhomogeneities and tunneling factor in the current transport mechanisms. The value of Richardson's constant found to be 1.5 x 10(5) Am-2 K-2 which is of the order of known theoretical value of 3.2 x 10(5) Am-2 K-2.
机译:在这项研究中,我们报告了Ni / n-TiO2 / p-Si / Al异质结的生长和电学特性。通过脉冲层沉积技术将TiO2薄层沉积在p-Si上。通过热镀系统沉积高纯度的镍和铝金属,以分别与n-TiO2和p-Si接触。脉冲激光烧蚀处理的Ni / n-TiO2 / p-Si / Al异质结在80 K至300 K的较宽温度范围内均显示出良好的整流性能。X射线衍射(XRD)研究已证实,该外延生长TiO2膜是高度取向的纳米晶体,粒径为43.3 nm。利用UV-VIS光谱和Tauc图研究了TiO2薄膜的光能带隙,结果为3.20 eV。原子力显微镜对表面形态的研究表明,该表面相当光滑,均匀且粗糙度为纳米量级。通过正向和反向偏置电流-电压(I-V)测量研究了通过异质结的主要电流传输机制。当前的传输机制是温度的强大函数,并使用具有势垒高度的高斯分布的热电子发射扩散(TED)机制成功地进行了解释。势垒高度对温度的依赖性以及活化能图的非线性已证实,n-TiO2 / p-Si界面的势垒高度遵循高斯分布。势垒高度和标准偏差的平均值分别为0.79 eV和0.10V。异质结的有效电阻在I-V特性以及整流特性中起着重要作用。还根据反向偏置电容-电压(C-V)特性研究了势垒高度随温度的变化。根据电流测量和电流测量结果计算出的势垒高度之间的差异,归因于当前传输机制中势垒不均匀性和隧穿因子的存在。发现理查森常数的值为1.5 x 10(5)Am-2 K-2,约为已知理论值3.2 x 10(5)Am-2 K-2。

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