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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Low-Power InP-HEMT Switch IGs Integrating Miniaturized 2×2 Switches for 10-Gb/s Systems
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Low-Power InP-HEMT Switch IGs Integrating Miniaturized 2×2 Switches for 10-Gb/s Systems

机译:低功耗InP-HEMT交换机IG集成了适用于10 Gb / s系统的小型2×2交换机

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This paper presents a wideband cold-FET switch with virtually zero power dissipation. The use of InP HEMTs with a low R{sub}(on) · C{sub}(off) product enables us to configure a DC-to-over-10-GHz single-pole double-throw (SPDT) switch without using a shunt FET. The series-FET configuration offers a logic-level-independent interface and makes possible positive control voltage operation in spite of using depletion-mode FETs. A miniaturized 2×2 switch using two SPDT switches yields an insertion loss of less than 1.16 dB and isolation of more than 21.2 dB below 10 GHz, which allows us to increase the scale of the switch in a single chip easily. The add-drop operation combining two 2×2 switches in a single chip and a 4 × 4 switch IC integrating four 2×2 switches are presented. The packaged ICs achieve error-free operation up to 12.5 Gb/s with either positive or negative logic-level input. Extremely fast switching of ~140 ps is also successfully demonstrated.
机译:本文提出了一种带宽为零的宽带冷FET开关。使用具有低R {sub}(on)·C {sub}(off)产品的InP HEMT,使我们无需使用DC即可配置DC至-10-GHz的单刀双掷(SPDT)开关并联FET。尽管使用了耗尽型FET,但串联FET配置提供了与逻辑电平无关的接口,并使得正控制电压工作成为可能。使用两个SPDT开关的小型2×2开关在10 GHz以下产生的插入损耗小于1.16 dB,隔离度大于21.2 dB,这使我们能够轻松地在单个芯片中增加开关的规模。提出了将两个2×2开关集成在一个芯片中以及一个4×4开关IC集成了四个2×2开关的拖放操作。封装的IC具有正或负逻辑电平输入,可实现高达12.5 Gb / s的无错误操作。还成功证明了〜140 ps的极快切换速度。

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