Development of a Thermoelectric Energy Generator Chip of Small Layout and High Power/Voltage Factors by Foundry Service

摘要

Thermoelectric energy generator (TEG) is a device which is used to convert temperature difference between the hot and cold junctions into electrical energy. This paper aims at developing a TIE chip of small layout 5 mm(2) having three 2.01 mm x 0.72 mm cells in a total of 10080 thermocouples by semiconductor foundry service (TSMC) for the advantages in batch production, low cost, and scalability. The design has the unique features to improve TEG performance by having (1) thin-film polycrystalline silicon-germanium Si-0.9 Ge-0.1 layer for higher thermoelectric conversion efficiency, (2) isolation cavity for better thermal insulation, and (3) structural support for improved thermocouple dimensional stability. It is shown that the TEG chip can deliver cower factor 0.125 mu W/cm(2) K-2 and voltage factor 25.91 V/cm h K. The experimental verification demonstrates that the 5 mm(2) chip has output power 2.083 mu W and voltage 3.4 V at 20 K temperature gradient. This is by far the TEG design with best thermoelectric performance implemented by the semiconductor foundry service.