首页> 外文期刊>Semiconductor science and technology >The role of oxygen partial pressure and annealing temperature on the formation of W=O bonds in thin WO_3 films
【24h】

The role of oxygen partial pressure and annealing temperature on the formation of W=O bonds in thin WO_3 films

机译:氧分压和退火温度对WO_3薄膜中W = O键形成的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Thin films of tungsten oxide were deposited onto silicon substrates using reactive rf sputtering. The structure of the films is strongly dependent on the conditions of deposition and post-treatment. Important issues are the influences of oxygen pressure during deposition and of annealing temperature. We used x-ray photoelectron spectroscopy to investigate the in-depth composition of the films. The most surface sensitive O 1s core level spectra are made up of two structures, one generated by photoelectrons emitted from oxygen atoms in WO_3 (O-W-O) and other at lower energy generated by the photoelectrons emitted from oxygen atoms located at the boundary of the grains (W-O).
机译:使用反应性射频溅射将氧化钨薄膜沉积到硅基板上。膜的结构在很大程度上取决于沉积和后处理的条件。重要的问题是沉积过程中氧气压力的影响以及退火温度的影响。我们使用X射线光电子能谱研究了薄膜的深层组成。对表面最敏感的O 1s核心能级谱由两种结构组成,一种是由WO_3(OWO)中的氧原子发出的光电子产生的,另一种是由位于晶粒边界处的氧原子发出的光电子产生的能量较低( WO)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号