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The effect of different proximity caps on quantum well intermixing in InGaAsP/InP QW structures

机译:InGaAsP / InP QW结构中不同接近帽对量子阱混合的影响

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A low-temperature InP-cap layer is used to enhance quantum well intermixing (QWI) following rapid thermal annealing (RTA) on an InGaAsP quantum well (QW) structure. The influence of different proximity caps ( Si, InP and GaAs) used during the RTA step has been investigated. A combination of cross-sectional transmission electron microscopy and high-resolution TEM together with energy-dispersive x-ray analysis directly reveals compositional and morphological changes resulting after QWI. Room temperature photoluminescence is used to establish the changes in emission wavelength and intensity resulting from the QW modification. Use of a Si proximity cap leads to the formation of a sharply defined QW with the least amount of QW modification, while GaAs proximity capping results in the broadest QW, broadened QW/barrier interfaces and the highest concentration of phosphorous in the well. Use of an InP proximity cap results in intermediate QW modification. In all cases, after QWI the bottoms of the QWs are flat and the well is square-like with broadened sidewalls. It has also been found that group V rich precipitates are produced on the top two layers of the structure. The concentration and size of the precipitates are minimum with Si proximity capping, while the use of GaAs produces the highest concentration and largest precipitates. The concentration and size of the precipitates are intermediate for the InP capping. The choice of proximity cap material affects the intermixing through changes of the effective P diffusivity which has been calculated from obtained profiles.
机译:低温InP盖层用于在InGaAsP量子阱(QW)结构上进行快速热退火(RTA)之后增强量子阱混合(QWI)。已经研究了在RTA步骤中使用的不同接近度帽(Si,InP和GaAs)的影响。截面透射电子显微镜和高分辨率TEM结合能量色散X射线分析直接揭示了QWI后产生的成分和形态变化。室温光致发光用于确定QW修饰导致的发射波长和强度的变化。使用Si接近盖会导致形成QW量最少的清晰定义的QW,而GaAs接近盖会导致最宽的QW,更宽的QW /势垒界面和井中磷的最高浓度。使用InP接近盖会导致中间QW修改。在所有情况下,QWI后,QW的底部都是平坦的,井是正方形的,侧壁变宽。还发现在该结构的最上面的两层上产生了富Ⅴ族的沉淀。用Si接近封顶法沉淀物的浓度和尺寸最小,而使用GaAs产生最高的浓度和最大的沉淀物。沉淀物的浓度和大小介于InP封端的中间位置。接近帽材料的选择会通过有效P扩散率的变化影响混合,而有效P扩散率的变化已从获得的轮廓计算得出。

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