首页> 外文期刊>Semiconductor science and technology >Ion milling-induced conductivity-type conversion in p-type HgCdTe MBE-grown films with graded-gap surface layers
【24h】

Ion milling-induced conductivity-type conversion in p-type HgCdTe MBE-grown films with graded-gap surface layers

机译:带有梯度间隙表面层的p型HgCdTe MBE生长膜中的离子铣削诱导的电导率类型转换

获取原文
获取原文并翻译 | 示例
       

摘要

In this paper, ion milling-induced conductivity-type conversion in p-type HgCdTe molecular beam epitaxy-grown films with graded-gap surface layers is studied. As expected, the chemical composition of the graded-gap layer strongly affects the conversion depth. At the composition of the layer on the surface, x_v > 0.5, ion fluences typically used for fabricating p-n junctions in HgCdTe create only a damaged surface n~+-layer with no deep conversion. With lower x_v, conversion with controllable depth due to diffusion of interstitial mercury atoms Hgi can be achieved. Defect reactions in the graded-gap surface layers under the milling and post-milling ageing, which are caused by interaction of Hg_I with dislocations, differ from those in the deep converted layers, where Hg_I reacts with point defects. It is shown that when assessing the depth of a p-n junction fabricated with ion milling in HgCdTe with a graded-gap surface layer, it is necessary to consider the effect of the material removal from the surface.
机译:本文研究了具有梯度间隙表面层的p型HgCdTe分子束外延生长膜中离子铣削引起的电导率类型转换。不出所料,渐变间隙层的化学成分会严重影响转化深度。在表面层的组成x_v> 0.5时,通常用于在HgCdTe中制造p-n结的离子通量仅产生损坏的表面n +层,而没有深层转化。通过较低的x_v,由于间隙汞原子Hgi的扩散,可以实现具有可控制深度的转化。 Hg_I与位错的相互作用在铣削和铣削后的时效作用下在梯度间隙表面层中产生的缺陷反应与深转换层中的缺陷反应不同,在深层转换层中,Hg_I与点缺陷反应。结果表明,在评估带有梯度间隙表面层的HgCdTe中离子铣削制造的p-n结的深度时,有必要考虑材料从表面去除的影响。

著录项

  • 来源
    《Semiconductor science and technology》 |2010年第6期|P.13.1-13.5|共5页
  • 作者单位

    Institute of Physics, Rzeszow University, 16A Rejtana Str., Rzeszow 35-310, Poland;

    rnR&D Institute for Materials SRC 'Carat', 202 Stryjska Str., Lviv 79031, Ukraine;

    rnA V Rzhanov Institute of Semiconductor Physics, Siberian Branch of the Russian Academy of Sciences, 13 Ac. Lavrentieva Str., Novosibirsk 630090, Russia;

    rnA V Rzhanov Institute of Semiconductor Physics, Siberian Branch of the Russian Academy of Sciences, 13 Ac. Lavrentieva Str., Novosibirsk 630090, Russia;

    rnA V Rzhanov Institute of Semiconductor Physics, Siberian Branch of the Russian Academy of Sciences, 13 Ac. Lavrentieva Str., Novosibirsk 630090, Russia;

    rnA V Rzhanov Institute of Semiconductor Physics, Siberian Branch of the Russian Academy of Sciences, 13 Ac. Lavrentieva Str., Novosibirsk 630090, Russia;

    rnPeter the Great Academy of the Strategic Missile Forces, Moscow 109074, Russia;

    rnIoffe Physical-Technical Institute of the Russian Academy of Sciences, 26 Polytechnicheskaya Str., St Petersburg 194021, Russia;

    rnTomsk State University, 36 Lenin Av., Tomsk 634050, Russia;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-18 01:31:43

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号