Transport Phenomena in Porous Low-k Dielentrics

摘要

To achieve materials with dielectric constants ≤2.5 while meeting all the properties required for dual-damascene integration at interconnect feature sizes of ≤100 nm, it is necessary to introduce controlled porosity into the material. At present, there is controversy involving the nature of the pores generated in the matrix of the materials: Should the pores be closed or open? Does it matter? What pore size is acceptable? Can process gases or water permeate porous materials?