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E-Manufacturing: The Evolution Continues

机译:电子制造:不断发展

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It should be no surprise that a semiconductor manufacturing fab is loaded with computer power. At the fab level, a computer-integrated manufacturing (CIM) system is coupled with manufacturing execution software (MES) to track lots, manage recipes and monitor the status of tools. What may be surprising is the lack of computer power when it comes to monitoring performance where it counts the most: at the most basic level of the process tool. Semiconductor manufacturing tools are complex entities and often need frequent maintenance or repair. Tool availability, or lack thereof, typically referred to as overall equipment effectiveness (OEE), can have a huge impact on fab efficiency. For the past five or six years, OEE has been identified in the International Technology Roadmap for Semiconductors (ITRS) as an area where major improvements are needed. To stay on the productivity curve defined by Moore's Law, experts say a 9-15% im- provement in OEE per year is required. An estimate of the average for the overall equipment effectiveness for all equipment is only 40-50% (Fig. 1).
机译:半导体制造厂配备了计算机电源也就不足为奇了。在晶圆厂级别,计算机集成制造(CIM)系统与制造执行软件(MES)结合在一起,可以跟踪批次,管理配方并监视工具状态。令人惊讶的是,在最重要的性能监控方面(最基本的过程工具级别),计算机能力不足。半导体制造工具是复杂的实体,通常需要经常维护或修理。工具的可用性或缺乏工具的可用性,通常称为整体设备效率(OEE),可能对制造效率产生巨大影响。在过去的五到六年中,OEE在国际半导体技术路线图(ITRS)中被确定为需要重大改进的领域。为了保持摩尔定律所定义的生产率曲线,专家表示,每年必须提高OEE 9-15%。所有设备总体设备效率的平均值估计仅为40-50%(图1)。

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