Application considerations for perfluoroelastomer seals used on wafer processing equipment

摘要

Wafer processing involves many aggressive chemicals and operates in severe environments. The trend towards larger wafers, smaller feature sizes and decreasing thickness of deposited layers has placed increased emphasis on the need to minimize or eliminate unwanted sources of process contamination. Since purity is critical to high wafer yield, reducing contamination from particulates, outgassing and extractables caused by seal deterioration are major goals of semiconductor fabricators.