Intel Talks About Double Exposure for Mainstream Manufacturing

摘要

When Intel (and soon thereafter, the rest of the industry) made the decision to pull the plug on 157 nm litho development, the path to advanced lithography suddenly became clearer: extension of 193 nm (ArF) as far as possible, followed by extreme ultraviolet (EUV). Then 193 nm immersion lithography hit the scene and made lithographers envision patterning of perhaps 45 nm or even 32 nm features using ArF with water, followed by higher-index media and lenses. Now, there is yet another scenario in town for extending ArF: double exposure technology.