Georgia Tech, Partners Launch 3-d Consortium

摘要

Georgia Institute of Technology's (Atlanta) Packaging Research Center (PRC), along with academia partners at Fraunhofer IZM (Berlin) and Koreas Advanced Institute of Science and Technology (Daedeok Science Town, Korea), will officially launch the 3-D All Silicon System Module (3DASSM) consortium in October. The consortium's long-term vision is a complete system that will be entirely silicon-based, according to 3DASSM program manager Ritwik Chatterjee. This includes all components, system boards, ICs and the package itself. Initially, the consortium plans to work on projects in five key categories: low-cost through-silicon vias (TSVs) and stack bonding; electrical design and test; packages with fine-line wiring; embedded active and passive components; and system interconnections. More than 20 research projects have been proposed.