Applied Introduces Dual-Wafer CMP System

摘要

With an eye to reducing the cost of CMP consumables, Applied Materials Inc. (Santa Clara, Calif.) is shipping a tool that polishes two wafers simultaneously on the same platen. The Reflexion GT system uses a pad that has 1.5x the area of a conventional CMP pad while polishing twice as many wafers. It also consumes ～30% less slurry per wafer, said Lakshmanan Karuppiah, general manager of Applied's CMP business unit.