Development of Fine Circuit Pattern Formation Process Using Nano-Metal Ink

摘要

We authors developed a fine circuit pattern formation process using the silver alloy nano-particles synthesized by electro-chemical reaction. Nano-particles dispersed ink was coated on the glass substrate and then sintered, to form thin metal films. By photolithographic etching method, a fine pattern of line width 5um with low resistivity 2uΩ ·cm or less was obtained. This method does not need a vacuum system, therefore, it is expected to reduce the cost for forming fine circuit patterns.